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An Introduction to Bonding for Electronic Facilities for Professional Engineers
| AUTHOR | Guyer, J. Paul |
| PUBLISHER | Independently Published (01/14/2022) |
| PRODUCT TYPE | Paperback (Paperback) |
Description
Introductory technical guidance for electrical engineers and construction managers interested in electrical design of electronic equipment buildings. Here is what is discussed: 1. DEFINITION OF BONDING, 2. PURPOSES OF BONDING, 3. RESISTANCE CRITERIA, 4. DIRECT BONDS, 5. INDIRECT BONDS, 6. SURFACE PREPARATION, 7. COMPLETION OF THE BOND, 8. BOND CORROSION, 9. WORKMANSHIP, 10. SUMMARY OF GUIDELINES.
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Product Format
Product Details
ISBN-13:
9798402324855
Binding:
Paperback or Softback (Trade Paperback (Us))
Content Language:
English
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Page Count:
56
Carton Quantity:
58
Product Dimensions:
8.50 x 0.15 x 11.00 inches
Weight:
0.45 pound(s)
Country of Origin:
US
Subject Information
BISAC Categories
Technology & Engineering | Electrical
Descriptions, Reviews, Etc.
publisher marketing
Introductory technical guidance for electrical engineers and construction managers interested in electrical design of electronic equipment buildings. Here is what is discussed: 1. DEFINITION OF BONDING, 2. PURPOSES OF BONDING, 3. RESISTANCE CRITERIA, 4. DIRECT BONDS, 5. INDIRECT BONDS, 6. SURFACE PREPARATION, 7. COMPLETION OF THE BOND, 8. BOND CORROSION, 9. WORKMANSHIP, 10. SUMMARY OF GUIDELINES.
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