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CFD Analysis of Processor Heat Sink

AUTHOR Dabhole, Akshaykumar
PUBLISHER LAP Lambert Academic Publishing (05/23/2020)
PRODUCT TYPE Paperback (Paperback)

Description
Every computer consists a processor and every processor release heat due to impedance offered by electronic circuits to electric current. Increased processing power causes increased heat dissipation, making processor temperature rise. This causes reduced processing speed, shortened life, malfunction or in some cases failure and thermal shutdown of processor. In this book, forced air cooling system mounted on processor was investigated. Effect of various air inlet locations and air velocity on processor temperature were numerically analysed by commercially available computational fluid dynamics software. The results shows that modifications in conventions air cooling system can lower temperature and hot-spot on the heat sink.
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Product Details
ISBN-13: 9786202555432
ISBN-10: 6202555432
Binding: Paperback or Softback (Trade Paperback (Us))
Content Language: English
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Page Count: 104
Carton Quantity: 68
Product Dimensions: 6.00 x 0.25 x 9.00 inches
Weight: 0.36 pound(s)
Country of Origin: US
Subject Information
BISAC Categories
Technology & Engineering | Engineering (General)
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Every computer consists a processor and every processor release heat due to impedance offered by electronic circuits to electric current. Increased processing power causes increased heat dissipation, making processor temperature rise. This causes reduced processing speed, shortened life, malfunction or in some cases failure and thermal shutdown of processor. In this book, forced air cooling system mounted on processor was investigated. Effect of various air inlet locations and air velocity on processor temperature were numerically analysed by commercially available computational fluid dynamics software. The results shows that modifications in conventions air cooling system can lower temperature and hot-spot on the heat sink.
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Your Price  $70.41
Paperback